The 5-day Wafer Fab Processing training programme offers comprehensive knowledge about the intricate semiconductor manufacturing process, enhancing technical skills through hands-on training in each process module.
Learning Outcome
- Understand the basic processes of a CMOS device (from device level until back-end processes)
- Understand the evolution of each processing technique, previous and current generation IC’s
- Understand the basic semiconductor wafer processing steps in each process module: diffusion, thin film, lithography and etch
- Learn the fundamentals of each processing step and the reason it is used in the industry today
Methodology
This course will utilise a combination of lecture and practical / hands-on lessons in a cleanroom
Duration
5 Days
Pre-requisite
Basics in physics
Target Group (who should attend)
This programme is designed for engineers, technicians, professionals and undergraduates/post-graduates students working in the semiconductor industry or seeking to enter this field. Whether you are a beginner or have some experience, this training programme is suitable for you.
Day 1
- Module 1: Safety and Hazard in Wafer Fabrication
- Module 2: Cleanroom Technology and Protocol
- Module 3: Introduction to IC Design
- Module 4: Semiconductor Material and Devices
- Module 5: Wafer Fabrication Process Theory
Day 2
- Module 6: Fabrication Process CMOS
Day 3
- Module 7: Wafer level testing (Test Lab)
- Module 8: Overview of the importance of failure
- analysis in semiconductor manufacturing
Day 4
- Module 9: Lithography module activities (cleanroom)
- Module 10: Etch module activities (cleanroom)
Day 5
- Module 11: Thin Film module activities (cleanroom)
- Module 12: Diffusion module activities (cleanroom)
