MIMOS Berhad and TÜBİTAK BİLGEM formalised their collaboration by signing a Memorandum of Understanding (MOU) to jointly explore and pursue opportunities in the semiconductor sector.
This partnership encompasses various areas, including training, process development, and design, focusing on front-end manufacturing and back-end packaging.
By combining the expertise and resources of both organisations, this strategic alliance aims to accelerate innovation, drive technological advancements, and strengthen the semiconductor ecosystem.
Together, MIMOS and TÜBİTAK BİLGEM will work to enhance Malaysia’s and Turkey’s capabilities in the global semiconductor landscape, contributing to the growth and sustainability of the industry.
