On 6 December 2024, MIMOS Berhad had the privilege of hosting a high-level meeting with the Senior Vice President, and delegates of NXP Semiconductors. The discussion centred on potential collaborations in advanced packaging technology, aligning with the National Semiconductor Strategy (NSS).
This strategic partnership aims to leverage the combined expertise of both organisations to drive innovation and strengthen Malaysia’s position as a global semiconductor hub. By sharing resources and knowledge, MIMOS and NXP can accelerate the development of cutting-edge semiconductor solutions and contribute to the growth of the semiconductor industry.
The success of this collaboration underscores MIMOS’ commitment to fostering industry partnerships and contributing to the nation’s technological advancement.
