MIMOS Berhad, in collaboration with the Centre for Design and Electronic Engineering (CEDEC), USM Penang, is proud to present a comprehensive training programme on Finite Element Analysis (FEA) for Advanced IC Packaging.
This intensive training programme is designed to equip participants with the essential knowledge and skills to apply FEA techniques to complex IC packaging challenges. Through hands-on exercises and real-world case studies, participants gained a deep understanding of FEA principles and their application to various packaging scenarios.
By the end of the training programme, participants were able to perform accurate FEA simulations for IC packages, interpret and analyse simulation results, optimise IC package designs for improved performance and reliability, as well as stay up-to-date with the latest advancements in FEA technology.
