Ansys: Mastering the Basics of Finite Element Analysis of Advanced IC Packaging is a comprehensive public training session designed to equip students, researchers, and professionals in the engineering field with the essential skills to conduct in-depth simulations and analyses of complex IC packaging designs. Through hands-on exercises and expert instruction, participants gained a solid foundation in finite element analysis (FEA) principles and their application to the intricacies of advanced IC packaging.
This training programme aims to enhance problem-solving abilities, optimise design processes, and accelerate product development cycles by leveraging the power of simulation.
By mastering Ansys software, participants will be empowered to make data-driven decisions, reduce physical prototyping costs, and improve overall product performance and reliability.
