Failure Analysis
MIMOS offers failure analysis for the E&E industry and members of the academia.
Our Failure Analysis, Material Analysis & Nanocharacterisation lab is MS ISO/IEC certified and a NANOVerify programme centre equipped with a complete spectrum of advanced analytical tools to provide high-value-added analytical services such as Electrical Verification, Fault Localisation, Non-Destructive Inspection, Material Analysis, and Physical Analysis.
- Logic and High Voltage Curve Tracer Electrical/parametric test verification tool for logic and high-voltage devices
Non-Destructive Inspection
- Real-time X-Ray (X-Ray) 2D inspection tool
- 3D X-Ray 3D inspection tool
- Scanning Acoustic Microscope (SAM) Inspection
Fault Localisation
- Photon Emission Microscope (PEM) and Optical Beam Induced Resistance Change (OBIRCH) Fault localisation system
- Thermal Emission Microscope Fault localisation system
- Magnetic Current Imaging (MCI) Fault localisation system
Physical Analysis
- Laser and Chemical Decapsulator Package opening
- Confocal and Digital Microscopes Visual inspection tool
- Dual-Beam (FIB and FESEM) High resolution inspection system
- Field Emission Gun Scanning Electron Microscope (FESEM)
Material Analysis
- Auger Electron Spectroscopy (AES)
- TOF Secondary Ion Mass Spectroscopy (ToF-SIMS)
- X-Ray Photoelectron Spectroscopy (XPS)
- TEM Upgrades with Electron Energy Loss Spectroscopy (EELS)
- Fourier Transform Infrared Spectroscopy (FTIR)
- Ultraviolet-visible and Infrared Spectroscopy (UV-Vis-IR)
- Inductively Coupled Plasma Mass Spectrometry (ICP-MS)
- Gas Chromatography-Mass Spectroscopy (GC-MS/MS)
- Nanoidentation