This course provides an introduction to material characterisation methods, techniques, and tools, focusing on operation concepts and applications, and teaches data interpretation. By emphasising foundational theories and translating information into real-world applications, this course seeks to improve participants’ ability to choose suitable strategies for practical application.
Learning Outcome
- The techniques used for surface and bulk material analysis
- The principles of operation of each technique
- Advantages and limitations of material characterisation technique
- Systematically identify and justify useful analytical technique for problem solving
Methodology
This course offers a mix of theoretical instruction and practical experience, including lectures, examples, and hands-on training at the MIMOS FA Lab.
Pre-requisite
No specific prerequisites are required, but experience in semiconductor industries is advantageous for deeper insights.
Duration
3 Days
Target Group (who should attend)
- Test and debug personnel
- Failure analyst and characterisation personnel
- Yield and reliability personnel
- Managers
- Laboratories personnel
- Researchers
- Anyone who submits devices to perform failure analysis
Day 1
- Introduction
- Safety and Hazard in Wafer Fabrication
- Overview of Failure Analysis
- NDT & Electrical analysis
- NDT & Electrical Analysis (Theoretical)
- Lab Visit & Equipment Demonstration
- Equipment: 2D & 3D X-ray, Curve Tracer, THEM, PEM.
Day 2
- Physical analysis
- Physical Analysis (Theoretical)
- Lab Visit & Equipment Demonstration
- Equipment: FESEM/VPFESEM, EBSD, Dual Beam, TEM, AFM, Nano-Indenter & SPM
Day 3
- Material analysis
- Material Analysis (Theoretical)
- Lab Visit & Equipment Demonstration
- Equipment: EDS, WDS, FTIR, Raman, Auger, XPS & TOF-SIMS
