Wafer Fabrication and Prototyping
We produce 200mm wafers at medium volume capacity in our Wafer Fabrication and Prototyping lab. Our operation is backed by robust technologies from IMS Germany and NTT Japan.
The 200mm wafer fabrication plant is fully equipped with industry-standard technology as well as machinery, to cater to various industrial and research requirements.
We are able to provide a wide range of services such as Design Support, Customised Processes, Multi-Project Wafer (MPW) programmes, and Product Development & Fabrication in CMOS, HVMOS, Digital, Analog and Microelectromechanical Systems (MEMS) technology platforms.
- Furnaces for Annealing and Various Film Deposition/Growth
- High Clean Bench
- Low Clean Bench
- Etch Bench
- Aluminum Etch Bench
- Metal Etch (Silicide Etch)
- Wafer Scrubber System
- Solvent Bench System
- High Current Ion Implanter System
- Medium Current Ion Implanter System
- Physical Vapour Deposition (PVD) System
- Rapid Thermal Processing (RTP) System
- Spin-on Glass (SOG) Coater System
- Film Stress Measurement System
- Four Point Probe System
- Fourier Transform Infrared Spectroscopy (FTIR)
- Wafer Marker
- Surfscan Inspection System
- Plasma Enhanced Chemical Vapour Deposition (PECVD) for Silicon Dioxide and Silicon Nitride Deposition
- Tungsten Silicide CVD System
- Tungsten CVD and Etchback System
- Sub-Atmospheric Chemical Vapour Deposition (SACVD) System
- Chemical Mechanical Polishing (CMP) System
- Bare Wafer Inspection System
- Reactive Ion Etching (RIE) equipment for Films (Oxide, Nitride, Poly, AlCu, AlSiCu, Silicon) Etching
- Poly Backside Etcher
- Resist Asher
- Step Height System
- Film Thickness Measurement System
- Ellipsometer System
- Stepper System
- Scanner System
- Coater/Developer
- Deep Ultra Violet (DUV) System
- Oven System
- Overlay System
- Pattern Wafer Inspection System
- Critical Dimension Scanning Electron Microscope (CDSEM) System Inspection Microscope System
